Hardware:Neo 1973:Alternate Cases
From Openmoko
This page is a repository for alternate case designs for the Neo1973, intended to be designed, built and fitted by the community/the phone's owner.
Each alternate case design suggestion needs some or all of: a description, intended uses, design options, a 3D model in an open format (e.g. .stl, .blend (Blender)), rendered images of the intended design, materials, components and information regarding interfacing electronically to components within the phone.
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Manufacture
There are numerous rapid prototyping companies that will very cheaply make small run components from various polymers, including:
Other materials may require traditional manufacturing techniques including milling, forging, injection-moulding, either by the user or short-run companies such as:
(4 axis) gantry style cnc router for hire. Click for inquiries
Cost Example
Rapid Object charge from 1.9 Euros per cm^3 of material (photosensitive polymer) used, plus postage. The case for the Neo looks to be about 1.5mm thick, so conservatively, the back of the case will be approximately:
120 x 60 x 1.5
+ 120 x 9 x 1.5 x 2 (2 sides)
= 10,800
+ 3,240
= 14,040 mm^3
~ 14 cm^3
~ 26 Euros
and the front will be (allowing for the screen hole):
(120 x 60 - 43 x 58) x 1.5
+ 120 x 9 x 1.5 x 2 (2 sides)
= 7,059
+ 3,240
= 10,299 mm^3
~ 10cm^3
~ 19 Euros
Notes
None of this can be accomplished without the dimensions of existing phones - if FIC are unable/unwilling to release precise dimensions, a user of a Neo1973 will need to measure their phone and upload the information to Neo1973 case schematics in the form of a 3D CAD model.
Some users may want combinations of the variants listed - popular/simple options such as Stylus Mount/Different speaker orientation/Extra battery/Extra storage may be combined into one model.
Design Variant Suggestions
Some of these are a copy of requests in Wish List - Hardware#Casing, some are from ideas thrown up in the community mailing list.
Many of these cannot be implemented without some design changes to the phone PCB. As mentioned in Expansion Back
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